एमपीयू-9250 vs ICM-20948 | datasheet, price, breakout TDK InvenSense

MPU9250/QFN package soldering

MPU 9250 Pinout Equivalent

1：Overview of the MPU 9250：

The MPU 9250 is a highly integrated nine-axis motion sensor that combines a gyroscope, accelerometer, magnetometer, and auxiliary functions. It includes an internal temperature sensor for temperature compensation, enhancing accuracy. The integrated hardware-level motion fusion algorithm directly outputs quaternions and Euler angles (pitch, roll, yaw), reducing the computational load on the main processor. It can be applied to drones and model aircraft, VR/AR devices, wearable devices (smart bracelets, watches), and robots and self-balancing systems.

2：MPU 9250 Important pin function definition:

3：Alternative model recommendation

BNO055：The BNO055 is a high-integration 9-axis inertial measurement unit (IMU) sensor developed by Bosch, which uses system-in-package (SiP) technology to integrate a three-axis 14-bit accelerometer, a three-axis 16-bit gyroscope, a three-axis geomagnetic sensor, and a 32-bit Cortex M0+ microcontroller into a 28-pin LGA package.

ICM-42688-P: ICM-42688-P is a high-precision 6-axis MEMS motion tracking device introduced by TDK InvenSense. It integrates a 3-axis gyroscope and a 3-axis accelerometer into a 2.5mm×3mm×0.91mm LGA-14 package, capable of measuring both linear acceleration and angular velocity, providing 6 degrees of freedom for motion detection. It supports I²C, and SPI serial communication interfaces, making it easy to connect with various microcontrollers and peripherals.

SC7A20TR：The SC7A20TR is a low-cost, low-power three-axis digital accelerometer launched by STMicroelectronics. It has a 14-bit resolution, selectable measurement ranges from ±2g to ±16g, and I²C/SPI interfaces. It is suitable for motion detection, tilt measurement, and vibration monitoring in wearable devices, mobile terminals, and industrial applications.

MPL3115A2：The LSM6DSOW is a system-in-package that integrates a 3D digital accelerometer and a 3D digital gyroscope, consuming 0.55 milliamps in high-performance mode and supporting low-power features. It supports real, virtual, and bulk sensors with a dynamic data batching capacity of 9 kilobytes. The MEMS sensor module series leverages robust and mature manufacturing processes already used for microfabricated accelerometers and gyroscopes. The IC interface is developed using CMOS technology, allowing the design of custom circuits and adjustments to better match the characteristics of the sensing elements.